Top 10 similar words or synonyms for thermosonically

eutectically    0.665976

andsolder    0.644293

thermosonic    0.643663

cerasolzer    0.625320

microsolder    0.602155

bsob    0.601882

thermocompressively    0.590954

presolder    0.585187

auau    0.584904

andsoldering    0.580653

Top 30 analogous words or synonyms for thermosonically

Article Example
Compliant bonding An important application for compliant bonding arose in the early 1960s, when techniques were developed for fabricating a “beam leaded silicon integrated circuit “chip” consisting of pre-attached electroformed 0.005-inch thick gold leads or “beams” extending from the silicon chip (Figure 5). Thus the beam leaded “chip” eliminated the need to thermosonically bond wires directly onto metallized pads of the fragile silicon chip (as shown in Figure 6) The extended ends of the electroformed beams could then be permanently solid-state bonded to a matching metallized sunburst circuit which has been pre-deposted on a ceramic substrate appropriately packaged in a computer in the making. Figure 7. shows a preshaped hard faced tool thermocompression bonding all of the beam leads of a chip in one bonding cycle. In order to avoid excessively deforming the fine beam leads with the hard bonding tool and putting them at risk of mechanical failure, the applied bonding forces have to be carefully monitored.
Integrated circuit Each device is tested before packaging using automated test equipment (ATE), in a process known as wafer testing, or wafer probing. The wafer is then cut into rectangular blocks, each of which is called a "die". Each good die (plural "dice", "dies", or "die") is then connected into a package using aluminium (or gold) bond wires which are thermosonically bonded to "pads", usually found around the edge of the die. . Thermosonic bonding was first introduced by A. Coucoulas which provided a reliable means of forming these vital electrical connections to the outside world. After packaging, the devices go through final testing on the same or similar ATE used during wafer probing. Industrial CT scanning can also be used. Test cost can account for over 25% of the cost of fabrication on lower-cost products, but can be negligible on low-yielding, larger, or higher-cost devices.