Top 10 similar words or synonyms for snpb

snagcu    0.886199

pbsn    0.883982

snpbag    0.865768

snbi    0.854895

snagcuin    0.830785

sncu    0.828195

bisn    0.820288

snau    0.820138

snin    0.820025

pbsnag    0.802818

Top 30 analogous words or synonyms for snpb

Article Example
Plumbide Lead can also create anions with tin, in a series of anions with the formula [SnPb].
Electromigration The typical current density at which electromigration occurs in Cu or Al interconnects is 10 to 10 A/cm. For solder joints (SnPb or SnAgCu lead-free) used in IC chips, however, electromigration occurs at much lower current densities, e.g. 10 A/cm.
The South End Twice during the late 1980s, left-leaning editors refused to run advertising from branches of the U.S. military. This resulted in at least one case in which the editor, Patricia Maceroni, was removed by the SNPB. She later resumed her editorship following a court challenge to the firing.
Thermal copper pillar bump Figure 4 shows a schematic of a typical CPB and a thermal bump for comparison. These structures are similar, with both having copper pillars and solder connections. The primary difference between the two is the introduction of either a P- or N-type thermoelectric layer between two solder layers. The solders used with CPBs and thermal bumps can be any one of a number of commonly used solders including, but not limited to, Sn, SnPb eutectic, SnAg or AuSn.
Shaped charge Unsintered cold pressed liners, however, are not waterproof and tend to be brittle, which makes them easy to damage during handling. Bimetallic liners, usually zinc-lined copper, can be used; during jet formation the zinc layer vaporizes and a slug is not formed; the disadvantage is an increased cost and dependency of jet formation on the quality of bonding the two layers. Low-melting-point (below 500 °C) solder/braze-like alloys (e.g., SnPb, ZnPb, or pure metals like lead, zinc or cadmium) can be used; these melt before reaching the well casing, and the molten metal does not obstruct the hole. Other alloys, binary eutectics (e.g. PbSb, SnPd, or AgCu), form a metal-matrix composite material with ductile matrix with brittle dendrites; such materials reduce slug formation but are difficult to shape.